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王凤江 教授 材料科学与工程学院 个人邮箱： fjwang@just.edu.cn 办公地点： 长山校区材料楼321室 通讯地址： 江苏省镇江市丹徒区长晖路666号 邮政编码： 212100 传真： 您是第18406 位访问者 个人简介 1977年2月生，江苏靖江人。博士，教授，硕士生导师，江苏科技大学功能材料系教工党支部支部书记，功能材料系主任，电子封装技术专业专业负责人。王凤江教授为江苏省青蓝工程中青年学术带头人、常州市龙城英才创新创业人才、泰州市创新人才、中国机械工程学会焊接学会钎焊及特种连接专业委员会委员。1998年华东船舶工业学院焊接设备及工艺专业本科毕业，2001年华东船舶工业学院材料加工工程专业硕士毕业，2006年获哈尔滨工业大学材料加工工程工学博士学位。2007年3月至2009年9月期间，美国密苏里科技大学博士后；2009年10月至2010年6月，美国亚历桑那州立大学博士后；2015年12月至2016年7月，美国德克萨斯大学访问学者；2020年1月至2021年4月，美国普渡大学高级访问学者。主要从事钎焊与扩散焊、电子封装材料及其可靠性等领域的研究工作。研究重点包括以下四方面：1. 表面组装用微互连材料的开发与应用；2. 微互连焊点的可靠性与失效分析；3. 扩散焊与钎焊技术；4. 电弧增材制造。在《Scripta Materialia》，《J Electronic Mater》，《J Mater Sci》，《J Alloy Compd》，《金属学报》，《中国有色金属学报》等国内外学术刊物和学术会议上发表论文SCI论文40余篇。美国矿石，金属材料研究学会(TMS)会员。是国际知名期刊Journal of Alloys and Compounds，Intermetallics和国际电子封装知名材料期刊J Electronic Mater的特约审稿人。迄今指导硕士研究生30余人。指导的研究生获国家奖学金5人次，江苏科技大学优秀毕业生3人次，省研究生创新计划4人次。学生就业去向包括博士深造、长江存储、晶科能源、SK海力士、恒电电子等高校或企业。欢迎焊接及金属材料等专业的优秀学子报考本课题组！ 研究方向 教育经历 教育经历：2001年9月 — 2006年6月      哈尔滨工业大学工学博士       专业：材料加工工程1998年9月 — 2001年3月      华东船舶工业学院工学硕士       专业：材料加工工程1994年9月 — 1998年7月      华东船舶工业学院工学学士       专业：焊接设备及工艺出国进修经历：2007年3月—2009年9月     Missouri University of Science & Technology（美国）博士后                 合作导师：Matthew O'Keefe2009年10月—-2010年6月  Arizona State University（美国）博士后                 合作导师：Nik Chawla2015年12月—2016年7月   University of Texas at Arlington（美国）访问学者             合作导师：Kim Choong Un2020年1月—-2020年7月  Arizona State University（美国）高级访问学者     合作导师：Nik Chawla2020年8月—-2021年4月  Purdue University（美国）高级访问学者     合作导师：Nik Chawla 课程教学 主要课程：电子封装可靠性理论与工程（本科生）微加工工艺（本科生）电子封装模拟技术（本科生）专业英语（本科生）微纳连接技术（研究生）高等焊接冶金（留学生） 科研项目 [1] 含Bi低银无铅焊点热疲劳条件下的组织及性能研究（吴俊），江苏省研究生创新计划，2022[2] 多场耦合混装焊点的可靠性及其失效机制研究(51875269)，国家自然科学基金面上项目，2019.1.1-2022.12.31，主持[3] 高效大功率LED倒装芯片用关键互连材料的开发，扬州市产业前瞻与共性关键技术，2019.1-2021.12，主持[4] 碳化MOF剥离制备的可控性GNRs增强埋入式电容介电性能的机理研究，国家自然科学基金青年项目，2019.1-2021.12，参与（2/5）[5] 泰州市“双创计划”，2018-2020，主持[6] MOF-GNRs结构与性能优化提升埋入式电容复合薄膜介电性能的研究，江苏省自然科学基金，2017-2020，参与（2/5）[7] 热迁移条件下 Sn58Bi 焊点的可靠性研究（王开鹏），江苏省研究生创新计划，2020[8] 热迁移/电迁移条件下的Sn-10Bi低温焊点原子迁移机制（陈红），江苏省研究生创新计划，2019[9] 光伏焊带用Sn-Bi基低温焊料的开发及其性能研究（刘鲁亭），江苏省研究生创新计划，2018[10] 电与热迁移耦合条件下的Sn基无铅焊点可靠性研究（李东洋），江苏省研究生创新计划，2017[11] 新型电子制造用喷射/选择焊接系统开发与产业化，常州市“龙城英才计划”第四批领军人才项目，2013年，主持[12] BGA返修焊点随机振动可靠性及其失效机制研究（BK2012163），江苏省自然科学基金，2012.8.1-2015.7.31，主持 专利成果 科研团队 教学随笔 论文著作 期刊Fengjiang Wang, Dapeng Yang, Guoqing Yin, Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging, Soldering & Surface Mount Technology, 2024王小伟, 王凤江*. Sn-58Bi微焊点组织与力学性能的尺寸效应行为. 焊接学报，2023, 44: 70Jiawei Chen, Mingqing Liao, Fengjiang Wang*. In or Ni addition on mechanical properties and interfacial growth in Sn–35Bi–1Ag solder joint during isothermal aging. Journal of Materials Science: Materials in Electronics, 2023, 34: 1558Mingqing Liao, Hongshun Gong, Nan Qu, Fengjiang Wang*, Jingchuan Zhu, Zi-kui Liu. CALPHAD aided mechanical properties screening in full composition space of NbC-TiC-VC-ZrC ultra-high temperature ceramics. International Journal of Refractory Metals and Hard Materials, 2023, 113: 106191Mingqing Liao, Jumahan Maimaitimusha, Xueting Zhang, Jingchuan Zhu and Fengjiang Wang*. P212121-C16: An ultrawide bandgap and ultrahard carbon allotrope with the bandgap larger than diamond. Frontiers of Physics, 2022, 17: 63507杨蔚然, 季童童, 丁毓, 王凤江*. 热老化与热循环条件下Bi添加对Sn-1.0Ag-0.5Cu低银无铅焊点界面组织与性能的影响. 焊接学报，2022, 43: 157-162董传淇, 王凤江*. SnAgCu/SnBi混装焊点的热循环可靠性研究. 江苏科技大学学报（自然科学版）, 2022 （已录用）Su-juan Zhong, Liang Zhang, Mu-lan Li, Wei-min Long, Fengjiang Wang, Development of lead-free interconnection materials in electronic industry during the past decades: structure and properties. Materials & Design, 2022, 215: 110439姜楠, 张亮, 孙磊, 王凤江, 龙伟民, 钟素娟. 热循环对Sn-58Bi-0.1Ti/Cu焊点界面与性能影响. 稀有金属材料与工程, 2022Tongtong Ji, Chuanqi Dong, Hong Chen, Mingqing Liao, Fengjiang Wang*. Effect of Trace Zn addition on interfacial reaction and shear properties of Sn-10Bi solder on Ni substrate. Microelectronics Reliability, 2022 (be submitted)Weiran Yang,  Yu Ding, Mingqing Liao, Fengjiang Wang*. Effect of trace Ge on interfacial reaction and shear strength in Sn-0.7Cu solder joints during aging and thermal cycling. Journal of Materials Science: Materials in Electronics, 2022, 33: 17133-17151  https://doi.org/10.1007/s10854-022-08589-9Jun Wu, Fengjiang Wang*, Kaipeng Wang. Thermomigration behavior of Sn-Bi joints under different substrate. Journal of Materials Science: Materials in Electronics, 2022, 33, pages8127–8139 https://doi.org/10.1007/s10854-022-07962-y王凤江*,何其航. 添加微量Zn对Sn-58Bi/Cu焊点老化过程中界面演变以及力学性能的影响. 机械工程学报, 2022,58(2): 284-290Mingqing Liao, Fengjiang Wang*, Jingchuan Zhu, Zhonghong Lai, Yong Liu. P2221-C8: A novel carbon allotrope denser than diamond. Scripta Materialia, 2022, 212: 114549Kai Qi, Guo Xu and Fengjiang Wang*. Interfacial behavior and shear strength of Al-25Si-4Cu-1Mg joints by transient liquid phase bonding with Cu as interlayer. Metals, 2021, 11: 1637Fengjiang Wang, Amey Luktuke, Nikhilesh Chawla*. Microstructural coarsening and mechanical properties of eutectic Sn-58Bi solder joint during aging. Journal of Electronic Materials, 2021, 50: 6607-6614Y. Wang, Z. Rao*, S. Liao, Fengjiang Wang. Ultrasonic welding of fiber reinforced thermoplastic composites: current understanding and challenges. Composites Part A, 2021, 149: 106578Qingfeng Wang, Yu Ding, Fengjiang Wang*. Effect of nano ZnO addition on wettability and interfacial structure of Sn-based Pb-free solders on Aluminum. Materiali in Tehnologije (Materials and Technology), 2020, 54: 79-83 (IF = 0.84)Qingfeng Wang,  Hong Chen, Fengjiang Wang*. Effect of trace Zn addition on the interfacial evolution in Sn-10Bi/Cu solder joints during aging. Materials, 2019, 12(24): 4240  (IF = 2.972)Kaipeng Wang, Fengjiang Wang*,Ying Huang, Kai Qi. Comprehensive properties of a novel quaternary Sn-Bi-Sb-Ag solder: wettability, interfacial structure and mechanical properties. Metals, 2019, 9(7): 791 (IF = 2.259)Dandan Feng, Fengjiang Wang*, Dongyang Li, Bin Wu, Luting Liu, Mingfang Wu.Atomic migration in Sn-58Bi solder from the interaction between electromigration and thermomigration. Materials Research Express, 2019, 6: 046301 (IF = 1.220)Fengjiang Wang*, Yu Ding, Luting Liu, Ying Huang, Mingfang Wu. Wettability, interfacial behavior and joint properties of Sn-15Bi solder. Journal of Electronic Materials, 2019, 48(10): 6835-6848  (IF = 1.64)Fengjiang Wang*, Hong Chen, Ying Huang, Luting Liu, Zhijie Zhang. Recent progress on development of Sn-Bi based low-temperature Pb-free solders. Journal of Materials Science: Materials in Electronics, 2019, 30: 3222-3243 (IF = 2.324，ESI高被引)Fengjiang Wang*, Hong Chen, Ying Huang, Chao Yan. Interfacial behaviors in Cu/molten Sn–58Bi/Cu solder joints under coupling with thermal and current stressing. Electronic Materials Letters, 2019, 15: 36-48 (IF = 2.882)Fengjiang Wang*, Luting Liu, Dongyang Li, Mingfang Wu. Electromigration behaviors in Sn-58Bi solder joints under different current densities and temperatures. Journal of Materials Science: Materials in Electronics, 2018, 29: 21157-21169 (IF = 2.324)Shuang Tian, Jian Zhou, Feng Xue, RuiHua Cao, Fengjiang Wang. Microstructure, interfacial reactions and mechanical properties of  Co/Sn/Co and Cu/Sn/Cu joints produced by transient liquid phase bonding. Journal of Materials Science: Materials in Electronics, 2018, 29: 13688-16400 (IF = 2.324)Fengjiang Wang*, Hong Chen, Ying Huang, Chao Yan. Interfacial behavior and joint strength of Sn-Bi solder with solid solution compositions. Journal of Materials Science: Materials in Electronics, 2018, 29: 11409-11420 (IF = 2.324)Fengjiang Wang*, Luting Liu, Mingfang Wu, Dongyang Li. Interfacial evolution in Sn–58Bi solder joints during liquid electromigration. Journal of Materials Science: Materials in Electronics, 2018, 29: 8895-8903 (IF = 2.324)Fengjiang Wang*, Dongyang Li, Shuang Tian. Electromigration Reliability of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints. Microelectronics Reliability, 2017, 73: 106-115 (IF = 1.236)Fengjiang Wang*, Dongyang Li, Jiheng Wang, Xiaojing Wang, Comparative study on the wettability and interfacial structure in Sn–xZn/Cu and Sn/Cu–xZn system, Journal of Materials Science: Materials in Electronics, 2017, 28: 1631-1643 (IF = 2.324)Fengjiang Wang*, Lili Zhou. Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint. Journal of Electronic Materials, 2017, 46: 6204-6213 (IF = 1.566)Fengjiang Wang*, Ying Huang, Zhijie Zhang, Chao Yan. Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints. Materials, 2017, 10: 920 (IF = 2.467)Fengjiang Wang*, Luting Liu, Lili Zhou, Jiheng Wang, Mingfang Wu, Xiaojing Wang. Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration. Materials Transactions, 2017, 58: 1593-1600 (IF = 0.675)Fengjiang Wang*, Dongyang Li, Zhijie Zhang, Mingfang Wu, Chao Yan. Improvement on interfacial structure and properties of Sn-58Bi/Cu joint using Sn-3.0Ag-0.5Cu solder as barrier. Journal of Materials Science: Materials in Electronics, 2017, 28: 19051-19060 (IF = 2.324)Shuang Tian, Saiping Li, Jiang Zhou, Feng Xue, Ruihua Cao and Fengjiang Wang. Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solder joints. Journal of Materials Science: Materials in Electronics, 2017, 28: 16120-16132 (IF = 2.324)Fengjiang Wang*, Lili Zhou, Xiaojing Wang, Peng He, Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging, Journal of Alloys and Compounds, 2016, 688: 639-648 (IF = 3.779)Fengjiang Wang*, Ying Huang. Mechanical properties of SnBi-SnAgCu composition mixed solder joints using bending test, Materials Science & Engineering A, 2016, 668: 224-233 (IF = 3.414)Shuang Tian, Fengjiang Wang*, Xiaojing Wang, Dongyang Li, Rapid microstructure evolution of structural composite solder joints induced by low-density current stressing, Materials Letters, 2016, 172: 153-156 (IF = 2.687)Fengjiang Wang, Matthew O’Keefe and Brandon Brinkmeyer. Microstructural evolution and tensile properties of SnAgCu mixed with Sn-Pb solder alloys. Journal of Alloys and Compounds, 2009, 477: 267-273Fengjiang Wang, et al. Intermetallic compound formation at Sn-3.0Ag-0.5Cu- 1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions. Journal of Alloys and Compounds, 2007, 438: 110-115.Wang, HQ; Wang, FJ; Gao, F, et al. Reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate. Journal of Alloys and Compounds, 2007, 433: 302-305.Fengjiang Wang, Feng Gao, Xin Ma, Yiyu Qian. Depressing effect of 0.2 wt% Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging. Journal of Electronic Materials, 2006, 35(10): 1818-1824.Fengjiang Wang, Xin Ma and Yiyu Qian.Improvement of microstructure and interface structure of eutectic Sn-0.7Cu solder with small amount of Zn addition. Scripta Materialia, 2005, 53: 699-702.Fengjiang Wang, Xin Ma and Yiyu Qian. Rate-dependent indentation behavior of solder alloys. Journal of Materials Science, 2005, 40: 1923-1928.Fengjiang Wang, Xin Ma andYiyu Qian.Indentation rate-dependent creep behavior of Sn-Ag-Cu Pb-free Ball grid array (BGA) solder joint. Materials Science Forums, 2005, 502: 399-404.Xin Ma, Fengjiang Wang, Yiyu Qian and Fusahito Yoshida. Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface. Materials letters, 2003, 57: 3361-3365.王凤江,钱乙余, 马鑫.微观压痕法测量Sn-Ag-Cu系无铅钎料的力学性能参数.中国有色金属学报,  2005,  15(5): 688-693.王凤江, 钱乙余, 马鑫.纳米压痕法测量SnAgCu无铅钎料BGA焊点的力学性能参数. 金属学报,  2005,  41(7) :  775-779.会议文章Fengjiang Wang, Dongyang Li. The influence of adding different Sn-based solder coating into Sn-58Bi/Cu interface on the growth of intermetallic compound. ICEPT 2017, Aug. 16-19, Harbin, ChinaFengjiang Wang, Ying Huang. The shear strength and fracture mode of Sn-xBi (x=0, 2.5, 5, 15)/Cu solder joints. ICEPT 2017, Aug. 16-19, Harbin, ChinaFengjiang Wang, Zhiping Xiao. Electromigration behavior of liquid Sn-58Bi/Cu joints through minor Zn alloying substrates. ICEPT 2017, Aug. 16-19, Harbin, ChinaFengjiang Wang, Matthew O’Keefe. Modeling of Pb-free BGA solder joint fatigue life during random vibration. TMS2010, Feb 14-18, 2010, Seattle, WA, USA.Fengjiang Wang, Matthew O’Keefe. Effect of Surface Finish, Package Size, and Rework on Pb-free Solder Ball Grid Arrays during Thermal Cycling. TMS2009, Feb 15-19, San Francisco, CA, USA.Fengjiang Wang, Matthew O’Keefe. Numerical and Experimental Analysis of Ball Grid Array Packages during Random Vibration. TMS2008, Mar 9-13, New Orleans, LA, USA.Matthew O’Keefe, Fengjiang Wang and Brandon Brinkmeyer. Effect of Incorporating Eutectic Sn-Pb Solder on the Microstructure and Tensile Properties of SAC 305 Pb-free Solder. 2008 International Materials Research Conference, June, 9-12, 2008, Chongqing,  China.H.Q. Wang,F.J. Wang, X. Ma, J. Liu and Y.Y. Qian. Study on reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate. The 6th International Conference on Electronics Packaging Technology, August 31-September 1, 2005, Shenzhen, China.Fengjiang Wang, Xin Ma and Yiyu Qian. Indentation rate-dependent creep behavior of Sn-Ag-Cu Pb-free Ball Grid Array (BGA) solder joint. IPC/Soldertec 2nd international conference on lead-free electronics, June 22-23, 2004, Amsterdam, Netherlands.F.J. Wang, X. Ma, Y.Y. Qian and F. Yoshida. A study on intermetallic compound layer development at Pb-free solder/Cu joint interfaces. Proceeding of the International Conference on Designing of Interfacial Structures in Advanced Materials and their Joints, Osaka Japan, 2002: 478-483.王凤江,钱乙余.无铅钎料/Cu界面间金属学行为研究.钎焊及特种连接会议论文集, 2002专利王凤江. 一种用于减少锡铋焊点金属间化合物形成的方法. 国家发明专利, 201610592181.0王凤江. 一种凸点下金属化层构件及制备方法. 国家发明专利, 201610953957.7吴建雄, 吴建新, 马鑫, 王凤江. 具有抗氧化能力的无铅焊料. 国家发明专利, 专利号ZL 03 1 10895.4吴建雄, 吴建新, 王凤江, 刘军, 王宏芹. 波峰焊用无铅软钎焊料合金. 国家发明专利, 专利号ZL 03 1 11446.6   获奖动态 1、环境友好型复合钎料创制及应用，中国机械工业科学技术一等奖，2015年2、钎缝缺陷产生诱因及防控技术，河南省科技进步二等奖，2019年，排名第三3、国家标准：软钎剂试验方法 第2部分：沸点法，2019年，排名第三