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王小京 副教授 材料科学与工程学院 个人邮箱： wxj@just.edu.cn 办公地点： 通讯地址： 邮政编码： 传真： 您是第7200 位访问者 个人简介 工学博士，副教授，硕士研究生导师。长期从事微电子互连材料及其结构的损伤与失效的实验与模拟研究，目前重点关注三维互连、功率互连以及微纳尺度界面、柔性连接、有机界面的可靠性。主持国家自然科学基金、江苏省自然科学基金、省产学研、省双创、苏州市人才项目、校级项目、校企合作以及横向项目20余项；主持教育厅教改项目2项、省优秀案例1项；参与国家自然科学基金3项、江苏省自然科学基金3项、国家外专局项目2项；以第一作者或通讯作者发表SCI/EI收录论文50余篇，授权专利20余项。欢迎具有不同学科背景的同学咨询（电子封装、材料、物理、计算机、电子信息） 研究方向 微电子互连材料与相分析；微互连界面结构及损伤与模拟计算技术；功率器件互连与仿真。 教育经历 课程教学 《电子封装结构与工艺》、《传热与传质基本原理》；《先进封装结构》、《Fundamentals of heat and mass transfer》。                科研项目 省重点研发计划核心技术专项子课题《先进电子封装用低温高韧性焊料合金设计、助焊剂开发与可靠性研究》2025结束，当前在研省研发计划化子课题《高强高韧互连结构设计及其可靠性》2024结束，在研省产学研《微锡焊点/界面可控性焊接工艺关键技术开发》2025结束，在研横向：键合焊点在多场耦合条件下的可靠性课题，在研（有对键合互连有兴趣的同学可以咨询报考硕士）长三角联创人才项目在研江苏省自然科学基金(No. BK20150466)，微凸点的化合物转变及其在热疲劳载荷下的损伤与失效（2018结题）国家自然科学基金(No. 51541104)，3D封装微锡焊点在全化合物转变后的热疲劳行为研究（2017结题）基金培育(No. 1062921505)，再布线后Low K层应力模拟与计算（2017结题） 专利成果 科研团队 获奖动态 教学随笔 论文著作 代表性论文L. Li, S.S. Cai, X.J. Wang*, R.Y. Ma* et al. Electrochemical noise analysis of corrosion sensitivity of Pb‑free solders in 5 wt% citric acid solution, Advanced Composites and Hybrid Materials(2024) 7:42, https://doi.org/10.1007/s42114-024-00856-zQ.Z. Li, M.C.Li, X,.J.Wang* S.S. Cai*, J.B. Peng, S.J. Chen, J.J.Wang, X.H. Yuan. Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging, Acta Metallurgica Sinica(English Letters),2024 doi:10.1007/s40195-024-01691-3.Q. Wang; S.S. Cai; S. Yang; Y.J. Yu; Y.K.Wan; J.B.Peng; J.J. Wang; X.J. Wang*, Comparison of high-speed shear properties of low-temperature Sn-Bi/Cu and Sn-In/Cu solder joints, Journal of Materials Science: Materials in Electronics, (2024)35:576.C.M. Li, S.J. Chen, S.S. Cai, J.B. Peng,X.J. Wang*, Y.W.Wang, microstructure and shear properties evolution of Mn doped SAC solder joint under isothermal aging,l, Journal of Iron and Steel Research International,30 (2023) 1650-1660.C. Liu, J.B. Peng, J.T. Hu, S.S. Cai*,X.J. Wang*, Effects of phosphorus and germanium on oxidation microstructure of Sn-0.7Cu lead-free solders,J Mater Sci: Mater Electron, 2023J.J. Wang, J.B. Peng, S.S.Cai* , X.J. Wang*，The effect of solvents on thermal stability of solder pastes in reflow process，J Mater Sci,2023 Xiaobin Luo, Jubo Peng, Weibin Zhang, Shuai Wang, Shanshan Cai*, Xiaojing Wang*，CALPHAD-guided alloy design of Sn–in based solder joints with multiphase structure and their mechanical properties (2)[J]. Materials Science & Engineering A, 2022,860:144284Z.F. Ding, X.J. Wang* , W.D.Wang, S.S.Cai, J.D. Guo, Q.S. Zhu*, Severe embrittlement of copper pillar bumps electrodeposited using JGB as leveler，J Mater Sci: Mater Electron (2022) 33:19026–19035刘晨，蔡珊珊，罗晓斌，彭巨擘，于智奇，王小京*，Sn-Bi二元合金应变速率敏感性的研究[J]. 电子元件与材料, 2022,41(07):763-769.Xiaojing Wang*, Yanjie Liu, Ning Liu*, Jiacheng Fan1, Muye Niu, Yanxin Qiao, Bin Liu，Laser assisted Al0.1CoCrFeNi High Entropy Alloy Coating: Microstructures and Properties，Int. J. Electrochem. Sci., 17 (2022) Article Number: xx, doi: 10.20964/Sen-Ming Xue, Shiqi Zhou, Xiaojing Wang*, Xiang-Hao Zeng, Zhi-Quan Liu，Microstructure coarsening of high-temperature Sn-Pb solder joint in IGBT modules of high-speed trains: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)[C], 10-13 Aug. 2022.  S.S. Cai, X.B. Luo, J.B. Peng, Z.Q. Yu, H.L. Zhou, N. Liu, X.J. Wang*, Study of deformation mechanism of various Sn-xBi alloys under tensile tests, Adv Compos Hybrid Mater,2021. 4(2): p. 379-391Y. k. Ma, Y. Zhang, M. Liu, T. L. Han, Y. L.Wang*, X. J. Wang*, Improving the performance of quantum dot sensitized solar cells by employing Zn doped CuInS2 quantum dots, Adv Compos Hybrid Mater,2021. https://doi.org/10.1007/s42114-021-00324-yM. Liu, Y. Ding, L.G. Wang, Y.L. Wang*, X.J. Wang*, Band structure, photoelectric properties, and electronic transition mechanism of CuGa1‑xTixS2 compound synthesized by solid‑state reaction sintering method, Adv Compos Hybrid Mater, 2021, https://doi.org/10.1007/s42114-021-00315-z  X. L.Wu,  J.W. Wu, X. J. Wang*, J. Yang, M. Xia, B. Liu, Effect of In additon on microstructure and mechnical properties of Sn-40Bi alloys. Journal of Materials Science. 2019, 55(7) 3092-3106.S.J. Li, Q.S. Zhu, B.D. Zheng,J. Yuan, X. J. Wang*, Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition, Materials Science and Engineering A. 2019, 758, 1-6.X. L.Wu, M. Xia, S. J. li, X. J. Wang*, B. Liu, J.X. Zhang, N. Liu*, Microstructure and mechanical behavior of Sn-40Bi-xCu alloy, J Mater Sci: Mater Electron, 2017, DOI 10.1007/s10854-017-7464-7Y. X. Chen, X. L. Wu, X. J. Wang, H. Huang, Effects of reflow time on the interfacial microstructure and shear behaviour of SAC/FeNi-Cu joint, Metals, 2016, 6 (5) :109N. Liu*, P. H. W, P. J. Zhou, Z. Peng, X. J. Wang*, Y. P. Lu, Rapid solidification and liquid-phaseseparation of undercooled CoCrCuFexNi alloys, Intermetallics，2016, 72: 44 - 52S.Tian, F.J. Wang*, X.J. Wang, D.Y. Li, Rapid microstructure evolution of structural composite solder joints induced by low-density current stressing,Mater. Lett. 172 (2016) 153-156X. J. Wang*, N. Liu, S. Shi, Y. X. Chen，XPS Depth Study on the Liquid Oxidation of Sn-Bi-Zn-X(Al/P) Alloy and the Effect of Al/P on the Film，Adv. Mater. Sci. Eng., 2015(5):1-10.X. J. Wang*，Y. X. Chen，Preparation and characterization of CdxZn1-xS thin films by chemical bath deposition，Mater. Res.Innov., 2015,19(S5):208-211.P.H. Wu, Z. Peng, N. Liu* , M.Y. Niu, Z.X. Zhu, X.J. Wang*, The Effect of Mn Content on the Microstructure and Properties of CoCrCu0.1Fe0.15Mo1.5MnxNi Near Equiatomic Alloys, Materials Transactions, 2015 , 57 (1)X. J. Wang*, Q. S. Zhu, B. Liu, N. Liu, F. J. Wang, Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder, J Mater Sci: Mater Electron, 2014(5):2297-2304.X. J. Wang*, Y. L. Wang，F. J. Wang，N. Liu，J. X. Wang， Effects of Zn, Zn and Al/P additions on the comprehensive properties of Sn-Bi solder, Acta Metall. Sin. (Engl. Lett.), 2014, 27(6): 1159-1164.X. J. Wang*，T. Y. Li, Y. X. Chen，J. X. Wang，Current induced interfacial microstructure and strength weakening of SAC/FeNi-Cu connection，Appl. Mechan. Mater., 2014, 651-653(1):11-15.W. Yao, Y.L. Wang*, X.J. Wang, J. Zhu, Z.F. Zhang , X.J. Yuan, CuInS2 thin films obtained by solid-state sulfurization, Materials Science in Semiconductor Processing 26 (2014) 175-181.W. Yao, Y. L. Wang*, L.G. Wang, X.J.Wang, Z.F. Zhang, Characterization and preparation of Cu2ZnSnS4 thin films by ball-milling, coating and sintering, Materials Letters, 134 (2014) 168-171X. J. Wang, Q.L. Zeng, Q. S. Zhu, Z. G. Wang, J. K. Shang*, Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints, J. Mater. Sci. Technol.,2010, 26(8):737-742.王小京，祝清省，王中光，尚建库*，Ag3Sn粗化模型及其对Sn-Ag-Cu焊料蠕变的影响, 2009.08. 金属学报2009, 45(8):912-918.