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个人简介 Contact me through: zhuochen@@csu.edu.cn 请手动去掉一个@ 自2008年攻读研究生起，一直从事先进电子封装研究，专攻方向为封装微互连结构制造。2015年博士毕业后以博士后、讲师身份进入中南大学工作，开始涉足三维集成封装及可靠性研究。目前主要研究方向包括： 1) 微电子封装互连的制造及可靠性 2) 表面微纳结构的高效制造及功能应用 目前共发表SCI论文20余篇，授权专利5项，主持国家自然科学基金青年项目一项（已结题）。 教育背景 2008年本科毕业于上海交通大学，获材料科学与工程专业学士学位 2015年研究生毕业于上海交通大学，获材料物理与化学专业博士学位 工作经历 2018至今，中南大学机电工程学院   微系统制造科学与工程系   副教授 2015-2018，中南大学机电工程学院   微系统制造科学与工程系   讲师 科研项目 国家自然科学基金青年项目“基于铜纳米孪晶的三维集成封装层间互连低温形成机理”，在研，主持 高性能复杂制造国家重点实验室自主课题"三维集成高品质片间互连的低温超声键合制造方法“，在研，主持 国家重点基础研究发展计划(973计划)课题"微互连界面物性演变机制与基于制造和服役全物理过程的协同设计" 代表性论文 石磊，刘振，陈卓*，李健辉，龙浩晖，朱文辉*. 手机结构设计因子对产品级跌落可靠性的影响，半导体技术，in press. Zhuo Chen, Cong Zhu, Meili Cai, Xinyao Yi and Junhui Li (2020). Growth and morphology tuning of ordered nickel nanocones routed by one-step pulse electrodeposition. Appl Surf Sci 508: 145291. Junhui Li, Yuexin Zhang, Haoliang Zhang, Zhuo Chen*, Can Zhou*, Xiaohe Liu and Wenhui Zhu (2020). The thermal cycling reliability of copper pillar solder bump in flip chip via thermal compression bonding. Microelectronics Reliability 104: 113543. Ganglong Li, Guang Zheng, Zijun Ding, Lei Shi, Junhui Li, Zhuo Chen*, Liancheng Wang, Andrew A. O. Tay, and Wenhui Zhu*, High-performance ultra-low-k fluorine-doped nanoporous organosilica films for interlayer dielectric, J Mater Sci, 2019 Junhui Li, Haoliang Zhang, Can Zhou*, Zhuo Chen*, Xinxin Chen, Zhili Long, Xiaohe Liu, Wenhui Zhu*, A multi-parameter numerical modeling and simulation of the dipping process in microelectronics packaging, IEEE T Ind Inform, 2019 Wenhui Zhu, Hanjie Yang, and Zhuo Chen*, Superior electromigration resistance of a microsized solder interconnection containing a single-Sn grain, Appl Phys Lett, 2018 Bo Wu, Shuanghai Zhang, Fuliang Wang*, and Zhuo Chen*, Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding, J Electron Pack, 2018 Zhuo Chen, Wenya Tian, Junhui Li, and Wenhui Zhu, Intermetallic Growth Induced Large-Scale Void Growth and Cracking Failure in Line-Type Cu/Solder/Cu Joints Under Current Stressing, J Electron Mater, 2018. Ganglong Li, Houya Wu, Honglong Luo, Zhuo Chen*, Andrew A. O. Tay, and Wenhui Zhu*, Diffusion behavior of Cu/Ta heterogeneous interface under high temperature and high strain: An atomistic investigation, AIP Adv, 2017, 7(9):095320. Xinyao Yi, Zhixuan Lu, Yu Kong, and Zhuo Chen*, Label-Free Electrochemical Detection of MicroRNAs via Intercalation of Hemin into the DNA/RNA Hybridization, Int J Electrochem Sci, 2017, 12(4):2813-2821. Zhuo Chen, Xianhe Zhang, Xian Fang, Hu He, and Wenhui Zhu,  2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016, pp. 1222-1225. Zhuo Chen, Hu He, Anmin Hu, and Ming Li,  Electronic Packaging Technology (ICEPT), 2015 16th International Conference on, 2015, pp. 1497-1500. Shixin Gao, Zhuo Chen, Anmin Hu, Ming Li, and Kaiyou Qian, Electrodeposited Ni microcones with a thin Au film bonded with Au wire, J Mater Process Technol, 2014, 214(2):326-333. Qin Lu, Zhuo Chen, Wenjing Zhang, Anmin Hu, and Ming Li, Low-temperature solid state bonding method based on surface Cu–Ni alloying microcones, Appl Surf Sci, 2013, 268:368-372. Zhuo Chen, Tingbi Luo, Tao Hang, Ming Li, and Anmin Hu, Enhanced Ni3Sn4 nucleation and suppression of metastable NiSn3 in the solid state interfacial reactions between Sn and cone-structured Ni, CrystEngComm, 2013, 15(48):10490. Zhuo Chen, Feifei Tian, Anmin Hu, and Ming Li, A facile process for preparing superhydrophobic nickel films with stearic acid, Surf Coat Tech, 2013, 231:88-92. 热烈欢迎有志本科生、硕士生报考！ 加入微电子课题组，实现人生价值！ (updated 202005)