教师主页移动版

程方杰 教师名称：程方杰 教师拼音名称：Cheng Fangjie 出生日期：1971-11-17 性别：男 职称：教授 其他联系方式 移动电话：022-27406261 邮箱：chfj@tju.edu.cn 基本信息 研究方向 获奖情况 论文成果 Areas of research interest1. Undwater welding technology;2. Brazing Processing and Brazing Flux for Moderate Temperature Aluminum Alloys;3. Advanced Joining Methods.Teaching1. Modern Arc Welding Power Source(Undergraduate);2. Introduction of Manufacture Technology(Undergraduate);3. (Graduate)Selected publications(Journal articles, patents and books)1. Fangjie CHENG, Hiroshi NISIKAWA, Tadashi TAKEMOTO,The Microstructure Characterization of Sn-Ag-Cu Solder with Small Amount of Co addition,13th Microjoining and assembly technology in electronics (Mate2007),Vol.13,2007,p193-196.2. Fangjie CHENG, Hiroshi NISIKAWA, Tadashi TAKEMOTO,Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder,International welding and joining conference (IWJC-Korea2007),Mater. Sci. Forum (Advanced welding and micro joining/packaging for the 21st century), vol. 580-582, p239-242.3. Fangjie CHENG, Hiroshi NISHIKAWA and Tadashi TAKEMOTO, Effects of Co Addition on the Microstructure and Tensile behavior of Sn-3.0Ag-0.5Cu Solder Alloy, Transactions of JWRI, Vol.36, No.1, 2007,p53-56.4. Feng GAO, Fangjie CHENG, Hiroshi NISHIKAWA and Tadashi TAKEMOTO, Characterization of Co-Sn Intermetallica Compounds in Sn-3.0Ag-0.5Cu-0.5Co Lead-free Solder Alloy, Mater. Lett.62 (2008), p2257-2259.5. Fangjie CHENG, Hiroshi NISHIKAWA and Tadashi TAKEMOTO, Estimation of the Thermal Fatigue Resistance and Creep Properties of the Co/Ni-Bearing SAC305 Lead-Free Solders by the Strain Rate Change Tensile Test Method. Mater. Trans. Vol.49, No.07 (2008) p.1503-1507.6. Fangjie CHENG, Hiroshi NISHIKAWA and Tadashi TAKEMOTO, Microstructural and Mechanical Properties of the SAC305 Solder Alloys Modified by the Dual Addition of Co-Ni, For the SPT'07 international conference. Accept by the High Temperature Society of Japan.7. Fangjie CHENG, Hiroshi NISIKAWA, Tadashi TAKEMOTO, Microstructure and Mechanical Properties of Sn-Ag-Cu Lead-Free Solder with Minor Addition of Co and Ni,J. Mater. Sci,(2008), vol.43,p.3643-3648.8. Fangjie CHENG, Feng Gao, Hiroshi NISHIKAWA and Tadashi TAKEMOTO, Interaction Behavior Between the Additives and Sn in Sn-3.0Ag-0.5Cu-based Solder Alloys and the Relevant Joint Solderability. J. of Alloys and Compounds. (2008) Doi:10.1016/j.jallcom.05.017.9. Fangjie CHENG, Feng Gao, Jianyou Zhang etal. Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys. J.Mater Sci (2011)46:3424-3429.10. Fangjie CHENG, Jianyou Zhang, Shensun Hu, Ping Shang. Numerical simulation on nugget formation and evolution in welding of Aluminum alloy. Transactions of Tianjin University. (2011), Vol.17, No.1. P.28-32. 1. Underwater welding technology;2. Brazing Processing and Brazing Flux for Moderate Temperature Aluminum Alloys;3. Advanced Joining 暂无内容 暂无内容 教育经历 1992.8-1996.7 Xi'an Jiaotong University   学士 1996.7-1999.3 Xi'an Jiaotong University   硕士 1999.3-2002.3 Tianjin University   博士 工作经历 2004.1 -2019.12 |Materials Sci. & Eng. School|Tianjin University|Associate Prof.