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梅云辉 教师名称：梅云辉 教师拼音名称：Mei Yunhui 出生日期：1985-05-25 性别：男 职称：副教授 其他联系方式 邮箱：yunhui@tju.edu.cn 基本信息 研究方向 获奖情况 论文成果 Areas of research interestPower electronics and materials; Reliability evaluation; Low temperature sinter-joining Micro-joining Fracture and plastic mechanics; Electrochemical migration; Finite element analysis.TeachingMicro-joiningHonors and awardsIEEE CPMT Japan Chapter Young Award;Peiyang Young Scholar" of Tianjin University.Research projectsTwo 863 projects and 2 NSFC projects.Selected publications (Journal articles, patents and books)Publications:List of publications (Indexed by SCI):[1] Fu, S., Mei, Y-H.*, Li, X., Ning, P., and Lu, G-Q., 2015, "Parametric study on pressureless sintering of nanosilver paste to bond large-area (>=100 mm2) power chips at low temperatures for electronic packaging", Journal of Electronic Materials, article in press.[2] Wang, M-Y., Lu, G-Q., Mei, Y-H.*, Li, X., Wang, L., and Chen, G., 2015, "Electrical method to measure the transient thermal impedance of insulated gate bipolar transistor module", IET Power Electronics, 8(6): pp. 1009-1016.[3]. Chen, G., Cui, S-B., You, L., Mei, Y-H.*, and Chen, X., 2015, "Experimental study on multi-step creep properties of rat skins", Journal of the Mechanical Behavior of Biomedical Materials, 46: pp. 49-58.[4]. Lu, G-Q., Yan, C-Y., Mei, Y-H.*, and Li, X., 2015, "Dependence of electrochemical migration of sintered nanosilver on chloride", Materials Chemistry and Physics, 151: pp. 18-21.[5]. Lu, G-Q., Yang, W., Mei, Y.*, Li, X., Chen, G., and Chen, X., 2014, "Migration of sintered nanosilver on alumina and aluminum nitride substrates at high temperatures in dry air for electronic packaging", IEEE Transactions on Device and Materials Reliability, 14(2), pp. 600-606.[6]. Lu, G-Q., Li, W., Mei, Y.*, Chen, G., Li, X., and Chen, X., 2014, "Characterizations of nanosilver joints by rapid sintering at low temperature for power electronic packaging", IEEE Transactions on Device and Materials Reliability, 14(2), pp. 623-629.[7]. Chen, G., Liang, H., Wang, L., Mei, Y.*, and Chen, X., 2014, "Multiaxial ratcheting-fatigue interaction on acrylonitrile-butadiene-styrene terpolymer (ABS)", Polymer Engineering and Science, 55(3): pp. 664-671.[8]. Fu, S., Lu, G-Q., Mei, Y.*, Li, X., Chen, G., and Chen, X., 2014, "Pressureless sintering of nanosilver paste at low temperature to join large area (>=100 mm2) power chips for electronic packaging", Materials Letters, 128, pp. 42-45.[9]. Chen, G., Yu, L., Mei, Y.*, Li, X., Chen, X., and Lu, G-Q., 2014, "Reliability comparison between SAC305 joint and sintered nanosilver at high temperatures for power electronic packaging", Journal of Materials Processing Technology, 214(9), pp. 1900-1908.[10]. Chen, G., Zhang, Z-S., Mei, Y-H.*, Li, X., Yu, D-J., Wang, L., Chen, X., 2014, "Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint", Mechanics of Materials, 72, pp. 61-71.[11]. Chen, G., Yu, L., Mei, Y.*, Li, X., Chen, X., and Lu, G-Q., 2013, "Uniaxial ratcheting behavior of sintered nanosilver joint for electronic packaging", Materials Science and Engineering A. 591(3), pp. 121-129.[12]. Mei, Y-H., Cao, Y., Chen, G., Li, X., Lu, G-Q., and Chen, X., 2014, "Characterization and reliability of sintered nanosilver joints by a rapid curren-assisted method for power electronic packaging", IEEE Transactions on Device and Materials Reliability, 14(1), pp. 262-267.[13]. Mei, Y-H., Lian, J-Y., Chen, X., Chen, G., Li, X., and Lu, G-Q., 2014, "Thermo-mechanical reliability of double-sided IGBT assembly bonded by sintered nanosilver", IEEE Transactions on Device and Materials Reliability, 14(1): pp. 194-202.[14]. Lu, G-Q., Yang, W., Mei, Y-H.*, Li, X., Chen, G., and Chen, X., 2014, "Mechanism of migration of sintered nanosilver at high temperatures in dry air for electronic packaging", IEEE Transactions on Device and Materials Reliability, 14(1), pp. 311-317.[15]. Mei, Y., Chen G., Li, X., Lu, G-Q., Chen, X., 2013, "Evolution of curvature under thermal-cycling in sandwich assembly bonded by sintered nano-silver paste", Soldering & Surface Mount Technology, 25(2), pp. 107-116.[16]. Mei, Y., Cao, Y., Chen, G., Li, X., Lu, G-Q., and Chen, X., 2013, "Rapid sintering nanosilver joint by pulse current for power electronics packaging", IEEE Transactions on Device and Materials Reliability. 13(1), pp. 258-265.[17]. Chen, G.; Zhang, Z-S., Mei, Y-H*., Li, X., Lu, G-Q., and Chen, X., 2013, "Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging", Microelectronics Reliability, 53(4), pp. 645-651.[18]. Chen, G., Cao, Y., Mei, Y.*, Li, X., Han, D., and Chen, X., 2013, "Simplification of low-temperature sintering nanosilver for power electronics packaging", Journal of Electronic Materials, 42(6), pp. 1209-1218.[19]. Li, X., Chen, G., Wang L., Mei, Y-H., Chen, X., and Lu, G-Q., 2013, "Creep properties of low-temperature sintered nano-silver lap shear joints", Materials Science and Engineering A, 579, pp. 108-113.[20]. Chen, G., Cao, Y., Mei, Y.*, Han, D., Lu, G. Q., and Chen, X., 2012, "Pressure-assisted low-temperature sintering of nanosilver paste for 5*5 mm2 chip attachment," IEEE Transactions on Components, Packaging and Manufacturing Technology, 2(11), pp. 1759-1767.[21]. Chen, G., Han, D., Mei, Y-H.*, Cao, X., Wang, T., Chen, X., and Lu, G-Q., 2012, "Transient thermal performance of IGBT power modules attached by low-temperature sintered nanosilver," IEEE Transactions on Device and Materials Reliability, 12(1), pp. 124-132.[22]. Mei, Y., Chen, G., Lu, G.-Q., and Chen, X., 2012, "Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly," International Journal of Adhesion and Adhesives, 35, pp. 88-93.[23]. Mei, Y., Wang, T., Cao, X., Chen, G., Lu, G-Q., and Chen, X., 2012, "Transient thermal impedance measurements on low-temperature-sintered nanoscale silver joints," Journal of Electronic Materials, 41(11), pp. 3152-3160.[24]. Kong, Y., Li, X., Mei, Y-H., and Lu, G-Q., 2015, "Effects of die-attach material and ambient temperature on properties of high-power cob blue led module", IEEE Transactions on Electron Devices, article in press.[25]. Yan, Y., Ngo, K., Hou, D., Mu, M., Mei, Y., and Lu, G-Q.*, 2015, "Effect of sintering temperature on magnetic core-loss properties of a nicuzn ferrite for high-frequency power converters", Journal of Electronic Materials, Article in press. 26. [26]. Tan, Y., Li, X., Chen, G., Mei, Y-H., and Chen, X.*, 2015, "Three-dimensional visualization of the crack-growth behavior of nano-silver joints during shear creep", Journal of Electronic Materials, 44(2): pp. 761-769.[27]. Wang, L., Chen, G.*, Zhu, J. Sun, X., Mei, Y-H., Ling, X., and Chen, X., 2015, "Bending ratcheting behavior of pressurized straight Z2CND18.12N stainless steel pipe", Structural Engineering and Mechanics, 52(6): pp. 1135-1156.[28]. Chen, G., Sun, X.-H., Nie, P., Mei, Y-H., Lu, G.-Q., and Chen, X*., 2012, "High-temperature creep behavior of low-temperature-sintered nano-silver paste films," Journal of Electronic Materials, 41(4), pp. 782-790.[29]. Li, X., Chen, G.*, Chen, X., Lu, G.-Q., Wang, L., and Mei, Y-H., 2012, "Mechanical property evaluation of nano-Silver paste sintered joint using lap-Shear test," Soldering and Surface Mount Technology, 24(2), pp. 120-126.[30]. Li, X., Chen, G*., Chen, X., Lu, G.-Q., Wang, L., and Mei, Y-H., 2013, "High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force," Microelectronics Reliability, 53(1), pp. 174-181.[31]. Yan, Y., Chen, X*., Liu, X., Mei, Y., and Lu, G.-Q., 2012, "Die bonding of high power 808 nm laser diodes with nanosilver paste," Transactions of the ASME Journal of Electronic Packaging, 134(4).[32]. Mei, Y., Lu, G.-Q., Chen, X., Gang, C., Luo, S., and Ibitayo, D., 2011, "Investigation of post-etch copper residue on direct bonded copper (DBC) substrates," Journal of Electronic Materials, 40(10), pp. 2119-2125.[33]. Mei, Y., Lu, G.-Q., Chen, X., Luo, S., and Ibitayo, D., 2011, "Migration of sintered nanosilver die-attach material on alumina substrate between 250 oC and 400 oC in dry air," IEEE Transactions on Device and Materials Reliability, 11(2), pp. 316-322.[34]. Mei, Y., Lu, G.-Q., Chen, X., Luo, S., and Ibitayo, D., 2011, "Effect of oxygen partial pressure on silver migration of low-temperature sintered nanosilver die-attach material," IEEE Transactions on Device and Materials Reliability, 11(2), pp. 312-315.[35]. Mei, Y., Chen, X., and Gao, H., 2009, "Hygrothermal effects on the tensile properties of anisotropic conductive films," Journal of Electronic Materials, 38(11), pp. 2415-2426.[36]. Mei, Y-H., Lian, J., Xu, Q., Li, X., Chen, X., and Cheng, W., 2014, "Strength and reliability of nanosilver paste bonding double-sided packaged IGBT assemblies", Journal of Mechanical Strength, 36(3): 352-356. [37]. Fu, S., Mei, Y.*, Li, X., and Lu, G-Q., 2014, "Bonding 1200 V, 150 A IGBT chips (13.5 mm*13.5 mm) with DBC substrate by pressureless sintering nanosilver paste for power electronic packaging", Proc. 15th International Conference on Electronic Packaging Technology, ICEPT 2014, p. 90-96.[38]. Lu, G-Q., Li, W., Mei, Y-H.*, and Li, X., "Measurements of electrical resistance and temperature distribution during current assisted sintering of nanosilver die-attach material", Proc. International Conference on Electronic Packaging, ICEP 2014, p. 538-543.[39]. Berry, D, Jiang, L., Mei, Y-H., Luo, S., Ngo, K., and Lu, G-Q., "Packaging of high-temperature planar power modules interconnected by low-temperature sintering of nanosilver paste", Proc. International Conference on Electronic Packaging, ICEP 2014, p. 549-554.[40]. Lu, G-Q., Yang, W., Mei, Y-H.*, Li, X., Chen, G., and Chen, X., "Effect of DC bias and spacing on migration of sintered nanosilver at high temperatures for power electronic packaging", Proc. 2013 14th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT 2013, August 11, 2013 - August 14, 2013, IEEE Computer Society, pp. 925-930.[41]. Lu, G-Q., Wang, M., Mei, Y-H.*, Li, X., Wang, L., Chen, G., and Chen, X., "An improved way to measure thermal impedance of insulated gate bipolar transistor (IGBT) module for power electronic packaging", Proc. 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p. 870-878.[42]. Cao, Y., Chen, G., Mei, Y-H.*, Li, X., Lu, G-Q., and Chen, X., "Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nano-silver paste", Proc. 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT 2012, August 13, 2012 - August 16, 2012, IEEE Computer Society, pp. 310-317.[43]. Lian, J., Mei, Y-H.*, Chen, X., Li, X., Chen, G., and Zhou, K., "Low-temperature sintering of nanoscale silver paste for double-sided attaching 9*9 mm2 chip", Proc. 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT 2012, August 13, 2012 - August 16, 2012, IEEE Computer Society, pp. 232-237.[44]. Mei, Y-H., Ibitayo, D., Chen, X., Luo, S., and Lu, G.-Q., "Migration of sintered nanosilver die-attach material on alumina substrate at high temperatures," Proc. 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT 2011, August 8, 2011 - August 11, 2011, IEEE Computer Society, pp. 787-792.Social AppointmentsIEEE member;Committee member of Device Sub-committee of China Power Supply Society. Power electronic applications and electronic packaging materials;High temperature reliability;Sintering process;Fracture and plastic mechanics;Metal electrochemical migration;Finite element 暂无内容 暂无内容 教育经历 2002.9-2006.7 Tianjin University   Processing Equipment and Control Engineering   学士 2006.9-2007.12 Tianjin University   Chemical Processing Equipment   硕士 2008.1-2010.12 Virginia Tech.   Electronic Materials and Engineering   博士 2008.1-2010.12 Tianjin University   Chemical Processing Equipment   博士 工作经历 2011.5 -2014.6 |School of Materials Science and Engineering|Tianjin University|Assistant Professor 2014.5 -2019.12 |School of Materials Science and Engineering|Tianjin University|Associate Professor